Google Pixel 9 and Pixel 9 Pro: 5G Modem and Satellite Connectivity Unveiled

Google's upcoming Pixel 9 and Pixel 9 Pro smartphones are set to feature significant design changes and receive two notable upgrades. Recent reports suggest that one of the upgrades will be a new 5G modem, while the other is satellite connectivity, a feature Apple plans to introduce with its iPhone 14 series in 2022.

Following the switch to semi-custom Tensor chipsets in 2021, Google's Pixel series encountered some modem issues. However, it appears that these issues will be resolved, as per Android Authority's report indicating that the Pixel 9 and Pixel 9 Pro will be powered by Samsung's Exynos 5400 5G modem. Although specific specifications were not provided, the baseband chip is expected to deliver faster performance while consuming less power compared to the Exynos 5300 used in previous-generation Pixel models.

Furthermore, the software stack of the Pixel phones has been upgraded to improve stability. Of particular significance, the Exynos 5400 will support 3GPP Release 17, enabling the utilization of 5G non-terrestrial networks (NTN), such as satellite-based communications. Google is reportedly working on implementing a "satellite distress" feature for Pixel phones, made possible through the company's partnership with T-Mobile, which has collaborated with SpaceX to establish the necessary infrastructure.

The Pixel 9 and Pixel 9 Pro will support satellite connectivity, primarily for text-based communications rather than calls. However, a dedicated "Satellite Gateway" application will allow easy communication with emergency services through an "SOS" feature. This new functionality is expected to be triggered when Pixel 9 or Pixel 9 Pro owners find themselves trapped or in life-threatening situations. It is hoped that Google, known for discontinuing projects, will continue supporting this feature as it has the potential to greatly save lives.

Additionally, not mentioned in the report, the Pixel 9 and Pixel 9 Pro will be equipped with Google's Tensor G4 chip. Previous reports suggested that this system-on-a-chip (SoC) would be a slight upgrade from the Tensor G3, but it has been revealed that the new chip will utilize "fan-out wafer-level packaging" (FOWLP) technology, similar to Samsung's Exynos 2400. This packaging technology not only enhances performance but also improves heat tolerance, allowing the Tensor G4 to maintain higher levels of multi-core performance. This change addresses concerns about overheating that were reported with the Tensor G3 and will likely be well-received by users.