Intel Completes Assembly of Second High-NA EUV Lithography Machine

According to media reports, ASML's CEO, Christophe Fouquet, has announced that Intel has completed the assembly of its second High-NA EUV lithography machine. Christophe Fouquet stated that unlike conventional EUV lithography machines, the High-NA EUV lithography machine is less likely to experience delivery delays as it can be assembled directly at the customer's facility without the need for disassembly and reinstallation, saving time and costs for customers and improving product delivery speed.

Intel Fellow and Lithography Director Mark Phillips mentioned that Intel has successfully completed the installation of two High-NA EUV systems at its factory in Portland, exceeding expectations in terms of speed. The assembly time for the second High-NA EUV lithography machine was actually shorter than the first, thanks to the necessary infrastructure being in place.

Simultaneously, the mask inspection work for the High-NA EUV lithography machine has commenced as planned. Mark Phillips stated that Intel is well-positioned to deploy it without requiring extensive additional support. Intel aims to achieve mass production with its Intel 14A process between 2026 and 2027, with the High-NA EUV lithography machine widely seen as crucial for Intel to regain its technological edge. Leading up to this, Intel will continue to optimize advanced process technologies to further enhance performance and cost-effectiveness.

Rumors suggest that ASML has received orders for over ten High-NA EUV lithography machines, including from Intel, TSMC, Samsung, SK Hynix, and Micron. TSMC also received its first High-NA EUV lithography machine last month, which has been transferred to its global research center for research to meet the development needs of future advanced processes like A14.